| Capacitor | Value | Package | Location | |-----------|-------|---------|----------| | Bulk | 47 µF (X5R) | 0805 | near power entry | | Mid-freq | 1 µF | 0402 | every 2–3 power pins | | High-freq | 100 nF | 0201 | directly under BGA (back side) | | Ultra-high | 10 nF + 470 pF | 0201 | adjacent to die power pins |

Designing a Power Delivery Network that maintains low impedance across a wide frequency range is the biggest challenge of 2026. This involves strategic placement of decoupling capacitors and minimizing loop inductance.

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